International collaboration EU and Japan on semiconductors

European Commission

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Expected Outcome:Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry.Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments

Use:
Date closing: September 24, 2026
Amount: -
Industry focus: All
Total budget: -
Entity type: Public Agency
Vertical focus: All

Status:
Open
Funding type:
Geographic focus: EU;
Public/Private: Public
Stage focus:
Applicant target:

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Overview

Expected Outcome:

Projects are expected to contribute to the following expected outcomes:

Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem

Expected outcomes should have direct and immediate impact on European industry.

Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.

Last updated on 2026-07-10 08:00