IA Resilience call reinforcing Europe's strength in photonics

European Commission

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Expected Outcome:Proposals submitted to this call are expected to address several of the following elements:• Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes.• Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration.• Integration of heterogeneous materials and components, such

Use:
Date closing: September 16, 2026
Amount: -
Industry focus: All
Total budget: -
Entity type: Public Agency
Vertical focus: All

Status:
Open
Funding type:
Geographic focus: EU;
Public/Private: Public
Stage focus:
Applicant target:

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Overview

Expected Outcome:

Proposals submitted to this call are expected to address several of the following elements:

• Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes.

• Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration.

• Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches.

• Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks.

• Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.

Last updated on 2026-07-10 08:00